公开(公告)号：US09082777B2

公开(公告)日：2015-07-14

申请号：US13710764

申请日：2012-12-11

Applicant: Huawei Device Co., Ltd.

Inventor： Xiong Yang

IPC: H01L21/56 ,  H01L21/58 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L25/165 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: Embodiments of the present invention disclose a method for encapsulating a component with plastic and its encapsulation structure, which belong to the plastic encapsulation technology field. The method includes: processing, by using the surface mounting technology, a first surface of a part to be encapsulated with plastic and/or performing die bonding on the first surface; encapsulating, with plastic, the first surface of the part to be encapsulated with plastic a second surface of the part to be encapsulated with plastic the first surface and/or performing die bonding in the second face; and encapsulating, with plastic, the second surface of the part to be encapsulated with plastic. This encapsulation structure includes a substrate, where components are fixed on an upper surface and a lower surface of the substrate, and the components on the upper surface and lower surface are all encapsulated with plastic in seal.

Abstract translation: 本发明的实施例公开了一种用塑料封装组件及其封装结构的方法，它们属于塑料封装技术领域。 该方法包括：通过使用表面安装技术处理待塑料部件的第一表面和/或在第一表面上执行芯片接合; 用塑料封装要用塑料封装的部件的第一表面，待塑料部件的第二表面将第一表面和/或在第二面中进行芯片粘合; 并用塑料封装要用塑料封装的部件的第二表面。 该封装结构包括基板，其中部件固定在基板的上表面和下表面上，并且上表面和下表面上的部件都用塑料密封封装。

公开(公告)号：US08907720B2

公开(公告)日：2014-12-09

申请号：US14144095

申请日：2013-12-30

Applicant: Huawei Device Co., Ltd.

Inventor： Xiong Yang ,  Bocheng Cao ,  Lei Wang

IPC: H01L25/00 ,  H01H21/18 ,  H01H11/00

CPC classification number: B81B3/0072 ,  B81B3/001 ,  B81B2201/014 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

Abstract: A capacitive switch includes: a first conductive cantilever, a second conductive cantilever, a substrate, a coplanar waveguide arranged on the substrate, the coplanar waveguide includes a first conductor configured to transmit an electrical signal, a second conductor and a third conductor are arranged as ground wires on two sides of the first conductor; an insulation medium layer is arranged on the first conductor, a conducting layer is arranged on the insulation medium layer; the first conductive cantilever is connected to the second conductor by using a first fixed end, the second conductive cantilever is connected to the third conductor by using a second fixed end; when a direct-current signal is transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever contact the conducting layer.

Abstract translation: 电容开关包括：第一导电悬臂，第二导电悬臂，衬底，布置在衬底上的共面波导，共面波导包括被配置为传输电信号的第一导体，第二导​​体和第三导体被布置为 第一导体两侧接地线; 绝缘介质层布置在第一导体上，导电层设置在绝缘介质层上; 第一导电悬臂通过使用第一固定端连接到第二导体，第二导​​电悬臂通过使用第二固定端连接到第三导体; 当在电容性开关上传输直流信号时，第一导电悬臂的第一自由端和第二导电悬臂的第二自由端接触导电层。

公开(公告)号：US20140285252A1

公开(公告)日：2014-09-25

申请号：US14144095

申请日：2013-12-30

Applicant: Huawei Device Co., Ltd.

Inventor： Xiong Yang ,  Bocheng Cao ,  Lei Wang

IPC: H01H21/18 ,  H01H11/00

CPC classification number: B81B3/0072 ,  B81B3/001 ,  B81B2201/014 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

Abstract: A capacitive switch includes: a first conductive cantilever, a second conductive cantilever, a substrate, a coplanar waveguide arranged on the substrate, the coplanar waveguide includes a first conductor configured to transmit an electrical signal, a second conductor and a third conductor are arranged as ground wires on two sides of the first conductor; an insulation medium layer is arranged on the first conductor, a conducting layer is arranged on the insulation medium layer; the first conductive cantilever is connected to the second conductor by using a first fixed end, the second conductive cantilever is connected to the third conductor by using a second fixed end; when a direct-current signal is transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever contact the conducting layer.

Abstract translation: 电容开关包括：第一导电悬臂，第二导电悬臂，衬底，布置在衬底上的共面波导，共面波导包括被配置为传输电信号的第一导体，第二导​​体和第三导体被布置为 第一导体两侧接地线; 绝缘介质层布置在第一导体上，导电层设置在绝缘介质层上; 第一导电悬臂通过使用第一固定端连接到第二导体，第二导​​电悬臂通过使用第二固定端连接到第三导体; 当在电容性开关上传输直流信号时，第一导电悬臂的第一自由端和第二导电悬臂的第二自由端接触导电层。