Invention Grant
US09083872B2 Imaging device with adhesive filling openings and related methods
有权
具有粘合剂填充口的成像装置及相关方法
- Patent Title: Imaging device with adhesive filling openings and related methods
- Patent Title (中): 具有粘合剂填充口的成像装置及相关方法
-
Application No.: US14032607Application Date: 2013-09-20
-
Publication No.: US09083872B2Publication Date: 2015-07-14
- Inventor: Jing-En Luan
- Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD
- Current Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD
- Current Assignee Address: CN Shenzhen
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: CN201210377434 20120928
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
An imaging device may include a housing, an image sensor IC in the housing, a lens adjacent the image sensor IC, and a cap over the lens and having an adhesive filling opening therein. The cap, the housing, and the lens may define an adhesive receiving cavity therein and in communication with the adhesive filling opening. The imaging device may also include adhesive material within the adhesive receiving cavity touching the cap, the housing, and the lens.
Public/Granted literature
- US20140092297A1 IMAGING DEVICE WITH ADHESIVE FILLING OPENINGS AND RELATED METHODS Public/Granted day:2014-04-03
Information query
