Invention Grant
- Patent Title: Wiring substrate and manufacturing method for wiring substrate
- Patent Title (中): 布线基板的布线基板和制造方法
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Application No.: US13386835Application Date: 2010-07-27
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Publication No.: US09084371B2Publication Date: 2015-07-14
- Inventor: Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
- Applicant: Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
- Applicant Address: JP Aichi-ken
- Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Current Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Current Assignee Address: JP Aichi-ken
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-174505 20090727; JP2009-174506 20090727; JP2009-276165 20091204
- International Application: PCT/JP2010/062638 WO 20100727
- International Announcement: WO2011/013673 WO 20110203
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H05K1/02 ; H05K3/20 ; H01L23/367 ; H01L23/498 ; H05K1/11 ; H05K3/34 ; H05K3/38
Abstract:
Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.
Public/Granted literature
- US20120119868A1 WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE Public/Granted day:2012-05-17
Information query
