发明授权
- 专利标题: Method for manufacturing electronic component with coil
- 专利标题(中): 用线圈制造电子元器件的方法
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申请号: US13804857申请日: 2013-03-14
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公开(公告)号: US09087634B2公开(公告)日: 2015-07-21
- 发明人: Shinichi Sakamoto , Douglas James Malcolm
- 申请人: SUMIDA Corporation
- 申请人地址: JP
- 专利权人: Sumida Corporation
- 当前专利权人: Sumida Corporation
- 当前专利权人地址: JP
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 主分类号: H01F7/06
- IPC分类号: H01F7/06 ; H01F27/02 ; H01F27/255 ; H01F41/02 ; H01F17/04
摘要:
A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
公开/授权文献
- US20140259640A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL 公开/授权日:2014-09-18
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