Invention Grant
- Patent Title: Heat dissipating module and heat dissipating method thereof
- Patent Title (中): 散热模块及其散热方法
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Application No.: US13463828Application Date: 2012-05-04
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Publication No.: US09087804B2Publication Date: 2015-07-21
- Inventor: Chun-Chieh Wong , Cheng-Yu Wang
- Applicant: Chun-Chieh Wong , Cheng-Yu Wang
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: CN201110115415 20110505
- Main IPC: H01L23/467
- IPC: H01L23/467 ; H01L23/34 ; H01L23/427 ; G06F1/20
Abstract:
A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.
Public/Granted literature
- US20120279688A1 HEAT DISSIPATING MODULE AND HEAT DISSIPATING METHOD THEREOF Public/Granted day:2012-11-08
Information query
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