Invention Grant
- Patent Title: Terminal connecting system
- Patent Title (中): 终端连接系统
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Application No.: US14093770Application Date: 2013-12-02
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Publication No.: US09088098B2Publication Date: 2015-07-21
- Inventor: Sunlyeong Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2012-0146591 20121214
- Main IPC: H01R11/30
- IPC: H01R11/30 ; H01R13/62 ; H01R13/633 ; H01R13/24 ; H01R13/635

Abstract:
An electronic device is provided comprising a connection interface including a connection portion; and a fastening portion comprising a plate that is configured to: (i) be substantially flush with a surface of the electronic device when the connection interface and a connector are not mated, and (ii) extend or recede from the surface of the electronic device when the connection interface and the connector are mated.
Public/Granted literature
- US20140170864A1 TERMINAL CONNECTING SYSTEM Public/Granted day:2014-06-19
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