A device for applying a two-part adhesive to a substrate includes a carrier, a first pump, a second pump, at least one manifold and at least one applicator. The first pump and the second pump are mounted on the carrier and each pump has an inlet and an outlet. The first pump pumps a first part of the two-part adhesive from its inlet to its outlet, and the second pump pumps a second part of the two-part adhesive from its inlet to its outlet. The at least one applicator is configured to mix the first part with the second part to form the two-part adhesive that is discharged from the outlet of the at least one applicator onto the substrate.