Invention Grant
US09089994B2 Device for cutting a substrate and method for controlling such a cutting device
有权
用于切割基板的装置和用于控制这种切割装置的方法
- Patent Title: Device for cutting a substrate and method for controlling such a cutting device
- Patent Title (中): 用于切割基板的装置和用于控制这种切割装置的方法
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Application No.: US14617660Application Date: 2015-02-09
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Publication No.: US09089994B2Publication Date: 2015-07-28
- Inventor: Marcus Flock
- Applicant: Hilti Aktiengesellschaft
- Applicant Address: LI Schaan
- Assignee: Hilti Aktiengesellschaft
- Current Assignee: Hilti Aktiengesellschaft
- Current Assignee Address: LI Schaan
- Agency: Crowell & Moring LLP
- Priority: DE102011089878 20111223
- Main IPC: B28D1/04
- IPC: B28D1/04 ; B28D1/10
Abstract:
A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
Public/Granted literature
- US20150151451A1 Device for Cutting a Substrate and Method for Controlling Such a Cutting Device Public/Granted day:2015-06-04
Information query
