Device for cutting a substrate and method for controlling such a cutting device
    1.
    发明授权
    Device for cutting a substrate and method for controlling such a cutting device 有权
    用于切割基板的装置和用于控制这种切割装置的方法

    公开(公告)号:US09089994B2

    公开(公告)日:2015-07-28

    申请号:US14617660

    申请日:2015-02-09

    Inventor: Marcus Flock

    Abstract: A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.

    Abstract translation: 公开了一种沿着切割线切割基板的装置。 该装置包括具有可绕旋转轴线旋转的锯片的锯单元,用于沿着导轨移动锯单元的导向架,以及用于控制锯单元和导向架的控制装置。 提供了用于标记切割线的终点的标记装置。

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