Invention Grant
US09090453B2 Sensor module and semiconductor chip 有权
传感器模块和半导体芯片

Sensor module and semiconductor chip
Abstract:
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.
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