公开(公告)号：US20240158224A1

公开(公告)日：2024-05-16

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81C1/00103 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0384 ,  B81C2201/013 ,  H04R2201/003

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US20240114292A1

公开(公告)日：2024-04-04

申请号：US18532607

申请日：2023-12-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: H04R7/08 ,  B81B3/00 ,  H04R7/16 ,  H04R19/04

CPC classification number: H04R7/08 ,  B81B3/0021 ,  H04R7/16 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2203/04 ,  H04R2201/003

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber

公开(公告)号：US20210139319A1

公开(公告)日：2021-05-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R31/00 ,  B81B3/00 ,  H04R1/08 ,  B81B7/02 ,  H04R7/08 ,  H04R7/02

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20180103325A1

公开(公告)日：2018-04-12

申请号：US15839546

申请日：2017-12-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

CPC classification number: H04R19/04 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R31/003 ,  H04R31/006 ,  Y10T29/49005

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

公开(公告)号：US20170164118A1

公开(公告)日：2017-06-08

申请号：US14959560

申请日：2015-12-04

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Marc Fueldner ,  Elmar Bach

IPC: H04R19/04 ,  H04R1/04 ,  H04R29/00 ,  H04R3/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2430/01

Abstract: A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to an analog interface to output a transduced electrical signal from the transducer, a data bus configured to be coupled to an environmental sensor, a calibration parameter storage circuit coupled to the data bus, the calibration parameter storage circuit comprising calibration data relating sensitivity of the transducer with environmental measurements provided by the environmental sensor, and a digital interface coupled to the data bus and configured to output the calibration data and the environmental measurements.

公开(公告)号：US11932533B2

公开(公告)日：2024-03-19

申请号：US17128638

申请日：2020-12-21

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/0023 ,  B81B7/02 ,  B81C1/00158 ,  B81C1/00182 ,  B81C1/00293 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/03 ,  B81C2201/0174 ,  B81C2203/0792

Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.

公开(公告)号：US11180361B2

公开(公告)日：2021-11-23

申请号：US16783587

申请日：2020-02-06

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Arnaud Walther

IPC: H04R1/00 ,  B81B3/00 ,  H04R1/04 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A MEMS device includes a first electrode structure and a second electrode structure forming a capacitive sensing arrangement. The MEMS device includes a plurality of anti-stiction bumps arranged between the first electrode structure and the second electrode structure at a corresponding plurality of locations. The plurality of locations being projected into a main surface of the second electrode structure is distributed so as to comprise a first distribution density in a first main surface region of the main surface and so as to comprise second, different distribution density in a second main surface region of the main surface, the second main surface region being delimited from the first main surface region.

公开(公告)号：US10981780B2

公开(公告)日：2021-04-20

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R31/00 ,  H04R7/02 ,  H04R1/08 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20210017016A1

公开(公告)日：2021-01-21

申请号：US16895366

申请日：2020-06-08

Applicant: Infineon Technologies AG

Inventor： Sebastian Anzinger ,  Christian Bretthauer ,  Marc Fueldner

IPC: B81B3/00 ,  B81C1/00 ,  H01L41/047 ,  H04R19/04

Abstract: A MEMS sound transducer element is operable in an audio and an ultrasonic range. The MEMS sound transducer element includes a first electrode structure, wherein a conductive material of the first electrode structure includes a plurality of electrically isolated electrode segments, and a second electrode structure spaced apart from the first electrode structure, wherein the first electrode structure and the second electrode structure are operable as an audio sound transducer. A first subset of the plurality of electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio emitter, and a second subset of the plurality of the electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio receiver.

公开(公告)号：US20200148531A1

公开(公告)日：2020-05-14

申请号：US16744857

申请日：2020-01-16

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Mandl ,  Marc Fueldner ,  Shu-Ting Hsu

IPC: B81B7/00 ,  H04R1/40 ,  H04R19/04 ,  H04R31/00 ,  H04R19/00 ,  H04R3/00 ,  H04R1/04 ,  B81C1/00 ,  B81B3/00

Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.