发明授权
US09093391B2 Integrated circuit packaging system with fan-in package and method of manufacture thereof
有权
具有扇入式封装的集成电路封装系统及其制造方法
- 专利标题： Integrated circuit packaging system with fan-in package and method of manufacture thereof
- 专利标题（中）： 具有扇入式封装的集成电路封装系统及其制造方法
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申请号： US12561897申请日： 2009-09-17
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公开(公告)号： US09093391B2公开(公告)日： 2015-07-28
- 发明人: SeungYun Ahn , JoHyun Bae , SangJin Lee
- 申请人： SeungYun Ahn , JoHyun Bae , SangJin Lee
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/31 ; H01L21/56 ; H01L25/065 ; H01L25/10 ; H01L23/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; connecting a base component directly to the base substrate; mounting a stack component over the base component; attaching a flattened exposed interconnect directly on the stack component; and applying an encapsulant over the stack component with a portion of the flattened exposed interconnect exposed.
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