Invention Grant
- Patent Title: Fluid handling apparatus
- Patent Title (中): 流体处理设备
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Application No.: US14031941Application Date: 2013-09-19
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Publication No.: US09101932B2Publication Date: 2015-08-11
- Inventor: Koichi Ono
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: ENPLAS Corporation
- Current Assignee: ENPLAS Corporation
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2012-206554 20120920
- Main IPC: B01L3/00
- IPC: B01L3/00 ; G01N27/00 ; G01N27/447 ; G01N27/26 ; G01N33/00

Abstract:
Microchannel chip (100) has film (120) adhered on the second surface of base (110) having a through-hole (111), and conductive layer (130). Film (120) has hole (121) and covers a second opening of the through-hole (111). Conductive layer (130) is integrally formed so as to extend from a portion of a bottom of hole (121) of base (110) to a portion of an inner surface of through-hole (111). Upon comparison with a microchannel chip in the related art, microchannel chip (100) is further reduced in size, has excellent handleability and is easy to be manufactured.
Public/Granted literature
- US20140079602A1 FLUID HANDLING APPARATUS Public/Granted day:2014-03-20
Information query
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