Invention Grant
- Patent Title: Sealed MEMS devices with multiple chamber pressures
- Patent Title (中): 密封的MEMS器件具有多个腔室压力
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Application No.: US14045855Application Date: 2013-10-04
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Publication No.: US09102512B2Publication Date: 2015-08-11
- Inventor: Christine H. Tsau , Li Chen , Kuang L. Yang
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; B81C1/00

Abstract:
A MEMS apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the MEMS apparatus also has a first outgas structure within the first chamber. The first outgas structure produces a first pressure within the first chamber, which is isolated from the second chamber, which, like the first chamber, has a second pressure. The first pressure is different from that in the second pressure (e.g., a higher pressure or lower pressure).
Public/Granted literature
- US20150097253A1 Sealed MEMS Devices with Multiple Chamber Pressures Public/Granted day:2015-04-09
Information query
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