发明授权
- 专利标题： Optical semiconductor element package and optical semiconductor device
- 专利标题（中）： 光半导体元件封装和光半导体器件
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申请号： US13459535申请日： 2012-04-30
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公开(公告)号： US09106047B2公开(公告)日： 2015-08-11
- 发明人: Yasuyuki Kimura , Mikio Suyama , Misuzu Machii
- 申请人： Yasuyuki Kimura , Mikio Suyama , Misuzu Machii
- 申请人地址： JP Nagano-shi
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP Nagano-shi
- 代理机构： Kratz, Quintos & Hanson, LLP
- 优先权： JP2011-105100 20110510
- 主分类号： H01S3/00
- IPC分类号： H01S3/00 ; H01S5/022 ; H01L23/053 ; H01L23/055 ; H01L23/495 ; H01S5/062 ; H01S5/0683
摘要：
An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.
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