发明授权
US09111472B2 Light-emitting diode module, backlight assembly having the LED module and display device having the backlight assembly
有权
发光二极管模块，具有LED模块的背光组件和具有背光组件的显示装置
- 专利标题： Light-emitting diode module, backlight assembly having the LED module and display device having the backlight assembly
- 专利标题（中）： 发光二极管模块，具有LED模块的背光组件和具有背光组件的显示装置
-
申请号： US13224169申请日： 2011-09-01
-
公开(公告)号： US09111472B2公开(公告)日： 2015-08-18
- 发明人: Joo-Woan Cho , Yong-Woo Lee , Hyoung-Joo Kim
- 申请人： Joo-Woan Cho , Yong-Woo Lee , Hyoung-Joo Kim
- 申请人地址： KR Yongin, Gyeonggi-Do
- 专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址： KR Yongin, Gyeonggi-Do
- 代理机构： F. Chau & Associates, LLC
- 优先权： KR10-2011-0019537 20110304
- 主分类号： G02F1/1335
- IPC分类号： G02F1/1335 ; F21V7/04 ; G09F13/22
摘要：
A backlight assembly includes a light-emitting diode (LED) module and a bottom chassis. The LED module includes an LED package in which at least one LED chip is mounted, and first and second wire sockets respectively making contact with lead frames formed at two sides of the LED package. The bottom chassis has a coupling hole formed through a bottom portion for receiving a coupling hook of the LED module. Thus, a wire socket is configured to make contact with a lead frame formed at a side portion of an LED package and power is received through a wire inserted through the wire socket, so that an additional printed circuit board (PCB) or an additional flexible printed circuit board (FPCB) for providing the LED package with power may be omitted.