发明授权
- 专利标题： Wafer assembly with carrier wafer
- 专利标题（中）： 带载体晶片的晶圆组件
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申请号： US13539243申请日： 2012-06-29
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公开(公告)号： US09111982B2公开(公告)日： 2015-08-18
- 发明人: I-Hsiung Huang , Heng-Hsin Liu , Heng-Jen Lee , Chin-Hsiang Lin
- 申请人： I-Hsiung Huang , Heng-Hsin Liu , Heng-Jen Lee , Chin-Hsiang Lin
- 申请人地址： TW
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
A wafer assembly includes a process wafer and a carrier wafer. Integrated circuits are formed on the process wafer. The carrier wafer is bonded to the process wafer. The carrier wafer has at least one alignment mark.
公开/授权文献
- US20130285264A1 WAFER ASSEMBLY WITH CARRIER WAFER 公开/授权日：2013-10-31
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