Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13974254Application Date: 2013-08-23
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Publication No.: US09112062B2Publication Date: 2015-08-18
- Inventor: JiSun Hong , Hyunki Kim , JongBo Shim , SeokWon Lee , Kyoungsei Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0119724 20121026
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/10 ; H01L25/00 ; H01L21/56 ; H01L25/065 ; H01L23/31
Abstract:
A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the first and second semiconductor packages. The molding pattern extends to cover at least a portion of a sidewall of only the second semiconductor package.
Public/Granted literature
- US20140117506A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-05-01
Information query
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