Invention Grant
- Patent Title: Method for filling recesses using pre-treatment with hydrocarbon-containing gas
- Patent Title (中): 用含烃气体预处理填充凹槽的方法
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Application No.: US13912666Application Date: 2013-06-07
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Publication No.: US09117657B2Publication Date: 2015-08-25
- Inventor: Akinori Nakano , Shintaro Ueda
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP HOLDING B.V.
- Current Assignee: ASM IP HOLDING B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer LLP
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method for filling recesses of a substrate with an insulation film includes: (i) exposing surfaces of the recesses of the substrate to a pre-deposition gas in a reactive state in a reaction space to treat the surfaces with reactive hydrocarbons generated from the pre-deposition gas without filling the recesses; and (ii) depositing a flowable insulation film using a process gas other than the pre-deposition gas on a surface of the substrate to fill the recesses treated in step (i) therewith by plasma reaction. The pre-deposition gas has at least one hydrocarbon unit in its molecule.
Public/Granted literature
- US20140363983A1 Method For Filling Recesses Using Pre-Treatment With Hydrocarbon-Containing Gas Public/Granted day:2014-12-11
Information query
IPC分类:
