Invention Grant
- Patent Title: Device for detecting the thinning down of the substrate of an integrated circuit chip
- Patent Title (中): 用于检测集成电路芯片的衬底的减薄的装置
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Application No.: US14082818Application Date: 2013-11-18
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Publication No.: US09121896B2Publication Date: 2015-09-01
- Inventor: Pascal Fornara , Christian Rivero
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Seed IP Law Group PLLC
- Priority: FR0953968 20090615
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01R31/28 ; G01L9/00 ; G06K19/073 ; H01L21/66 ; H01L23/00

Abstract:
A device for detecting the thinning down of the substrate of an integrated circuit chip, including, in the active area of the substrate, bar-shaped diffused resistors connected as a Wheatstone bridge, wherein: first opposite resistors of the bridge are oriented along a first direction; the second opposite resistors of the bridge are oriented along a second direction; and the first and second directions are such that a thinning down of the substrate causes a variation of the imbalance value of the bridge.
Public/Granted literature
- US20140070829A1 DEVICE FOR DETECTING THE THINNING DOWN OF THE SUBSTRATE OF AN INTEGRATED CIRCUIT CHIP Public/Granted day:2014-03-13
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