Invention Grant
- Patent Title: Tab lead and method of producing the same
- Patent Title (中): 制片人铅及其制作方法
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Application No.: US13778536Application Date: 2013-02-27
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Publication No.: US09123476B2Publication Date: 2015-09-01
- Inventor: Hiroshi Hata , Takurou Watanabe
- Applicant: Showa Denko Packaging Co., Ltd. , SHOWA DENKO K.K.
- Applicant Address: JP Kanagawa
- Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Keating & Bennett, LLP
- Priority: JP2012-43643 20120229
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01G11/74 ; H01M2/26 ; H01M2/30 ; H01M2/32 ; H01M10/0585 ; H01G11/80 ; H01M10/0525

Abstract:
A tab lead including a first insulating film made of resin is adhered to one of surfaces of a part of a region of a metal plate in a length direction of the metal plate and a second insulating film made of resin is adhered to the other surface of the part of the region. Both end portions of the first insulating film and both end portions of the second insulating film are integrally welded to each other. First protruding portions protruding outward in a thickness direction of the first insulating film are formed at regions of the first insulating film corresponding to both widthwise side edges of the metal plate and vicinities thereof. Second protruding portions protruding outward in a thickness direction of the second insulating film are formed at regions of the second insulating film corresponding to both widthwise side edges of the metal plate and vicinities thereof.
Public/Granted literature
- US20140072869A1 TAB LEAD AND METHOD OF PRODUCING THE SAME Public/Granted day:2014-03-13
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