Invention Grant
- Patent Title: Chip to dielectric waveguide interface for sub-millimeter wave communications link
- Patent Title (中): 芯片到介质波导接口用于亚毫米波通信链路
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Application No.: US12887323Application Date: 2010-09-21
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Publication No.: US09123737B2Publication Date: 2015-09-01
- Inventor: Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
- Applicant: Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Alan A. R. Cooper; Frank D. Cimino
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01L23/66 ; H01L23/31 ; H01L23/00

Abstract:
In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
Public/Granted literature
- US20120068891A1 CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK Public/Granted day:2012-03-22
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