Invention Grant
- Patent Title: Motherboard
- Patent Title (中): 母板
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Application No.: US13434879Application Date: 2012-03-30
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Publication No.: US09125324B2Publication Date: 2015-09-01
- Inventor: Heng-Yu Yen , Pai-Ching Huang
- Applicant: Heng-Yu Yen , Pai-Ching Huang
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW100112227A 20110408
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/24 ; H01L23/427 ; G06F1/20
Abstract:
A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
Public/Granted literature
- US20120257356A1 MOTHERBOARD Public/Granted day:2012-10-11
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