Invention Grant
US09126273B2 Tool for the cutting machining of workpieces and process for coating substrate bodies
有权
用于工件切割加工的工具和用于涂覆基体的工艺
- Patent Title: Tool for the cutting machining of workpieces and process for coating substrate bodies
- Patent Title (中): 用于工件切割加工的工具和用于涂覆基体的工艺
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Application No.: US14107268Application Date: 2013-12-16
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Publication No.: US09126273B2Publication Date: 2015-09-08
- Inventor: Joern Kohlscheen
- Applicant: Kennametal, Inc.
- Applicant Address: US PA Latrobe
- Assignee: KENNAMETAL INC
- Current Assignee: KENNAMETAL INC
- Current Assignee Address: US PA Latrobe
- Agent Matthew Gordon
- Priority: DE102012024638 20121217
- Main IPC: C23C16/06
- IPC: C23C16/06 ; B23C5/16 ; C23C14/06 ; C23C14/35

Abstract:
The invention relates to a tool having at least one layer of TixAl1-xN, where 0.2≦x≦0.8, which is composed of a plurality of laminar plies to give an overall layer thickness of 0.01 μm to 3 μm and which has crystallites having a size of ≦10 nm. To produce such a layer, by magnetron sputtering in an N2 atmosphere, Ti and Al are respectively released from separately arranged cathode targets, wherein the tool is moved past the cathode repeatedly at a speed which is such that in each case only a nanocrystalline layer forms upon this movement.
Public/Granted literature
- US20140169891A1 Tool For The Cutting Machining Of Workpieces And Process For Coating Substrate Bodies Public/Granted day:2014-06-19
Information query
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