Invention Grant
US09126273B2 Tool for the cutting machining of workpieces and process for coating substrate bodies 有权
用于工件切割加工的工具和用于涂覆基体的工艺

  • Patent Title: Tool for the cutting machining of workpieces and process for coating substrate bodies
  • Patent Title (中): 用于工件切割加工的工具和用于涂覆基体的工艺
  • Application No.: US14107268
    Application Date: 2013-12-16
  • Publication No.: US09126273B2
    Publication Date: 2015-09-08
  • Inventor: Joern Kohlscheen
  • Applicant: Kennametal, Inc.
  • Applicant Address: US PA Latrobe
  • Assignee: KENNAMETAL INC
  • Current Assignee: KENNAMETAL INC
  • Current Assignee Address: US PA Latrobe
  • Agent Matthew Gordon
  • Priority: DE102012024638 20121217
  • Main IPC: C23C16/06
  • IPC: C23C16/06 B23C5/16 C23C14/06 C23C14/35
Tool for the cutting machining of workpieces and process for coating substrate bodies
Abstract:
The invention relates to a tool having at least one layer of TixAl1-xN, where 0.2≦x≦0.8, which is composed of a plurality of laminar plies to give an overall layer thickness of 0.01 μm to 3 μm and which has crystallites having a size of ≦10 nm. To produce such a layer, by magnetron sputtering in an N2 atmosphere, Ti and Al are respectively released from separately arranged cathode targets, wherein the tool is moved past the cathode repeatedly at a speed which is such that in each case only a nanocrystalline layer forms upon this movement.
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