发明授权
- 专利标题: Plating pretreatment solution and method for producing aluminum substrate for hard disk devices using same
- 专利标题(中): 电镀预处理液及其制造方法
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申请号: US13981355申请日: 2012-01-19
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公开(公告)号: US09127170B2公开(公告)日: 2015-09-08
- 发明人: Nobuaki Mukai , Takahiro Yoshida
- 申请人: Nobuaki Mukai , Takahiro Yoshida
- 申请人地址: JP Tokyo
- 专利权人: Toyo Kohan Co., Ltd.
- 当前专利权人: Toyo Kohan Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: McCarter & English
- 优先权: JP2011-013139 20110125
- 国际申请: PCT/JP2012/051049 WO 20120119
- 国际公布: WO2012/102161 WO 20120802
- 主分类号: G11B5/84
- IPC分类号: G11B5/84 ; C09D1/00 ; C23C18/18 ; C23C18/32 ; B05D3/10
摘要:
An object of the invention is to provide a plating pretreatment solution that can convert the surface of an aluminum substrate for hard disk devices into a surface suitable for electroless nickel plating, and a method for producing an aluminum substrate for hard disk devices using the same. The plating pretreatment solution of the present invention used for a plating pretreatment in production of an aluminum substrate for hard disk devices has an iron ion concentration of 0.1 g/l to 1.0 g/l and a nitric acid concentration of 2.0 wt % to 12.0 wt %. This plating pretreatment solution is used for a pretreatment of a plating step in which electroless nickel plating is applied to an aluminum substrate for hard disk devices. Accordingly, the surface of the aluminum substrate for hard disk devices is converted into a surface suitable for electroless Ni plating, and a smooth surface of a plated film is obtained by suppressing generation of waviness, nodules, and pits on the plated surface when electroless nickel plating is performed in the plating step.