Invention Grant
- Patent Title: Module structural analysis supporting device and program
- Patent Title (中): 模块结构分析支持设备和程序
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Application No.: US14235040Application Date: 2012-07-10
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Publication No.: US09128807B2Publication Date: 2015-09-08
- Inventor: Shinichi Ishida
- Applicant: Shinichi Ishida
- Applicant Address: JP Odawara-shi, Kanagawa JP Tokyo JP Tokyo
- Assignee: Shinichi Ishida,Tsutomu Matsuzaki,I-SYSTEM CO., LTD.
- Current Assignee: Shinichi Ishida,Tsutomu Matsuzaki,I-SYSTEM CO., LTD.
- Current Assignee Address: JP Odawara-shi, Kanagawa JP Tokyo JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2011-162519 20110725
- International Application: PCT/JP2012/067577 WO 20120710
- International Announcement: WO2013/015109 WO 20130131
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06F13/10 ; G06F13/12 ; G06F9/45

Abstract:
A device supporting the structural analysis of a module comprises: a storage means storing at least one module; and a conversion means that converts a prescribed target module among the modules stored by the storage means to a secondary module and stores same in the storage means. The conversion means reads the target module from the storage means and sequentially outputs to the secondary module each sentence written from a prescribed processing start location in the target module to a prescribed processing end location. The conversion means also recursively develops a sentence written in processing units etc., for execution, and outputs same to the secondary module, when the sentence is a module internal processing unit or a sentence that executes another module.
Public/Granted literature
- US20140196009A1 MODULE STRUCTURAL ANALYSIS SUPPORTING DEVICE AND PROGRAM Public/Granted day:2014-07-10
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