Invention Grant
- Patent Title: Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package
- Patent Title (中): 制造包括在封装的支撑结构内的嵌入式电路部件的半导体封装
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Application No.: US13296707Application Date: 2011-11-15
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Publication No.: US09129908B2Publication Date: 2015-09-08
- Inventor: Jovica Savic , Zhiping Yang , Jie Xue , Li Li
- Applicant: Jovica Savic , Zhiping Yang , Jie Xue , Li Li
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/31 ; H01L23/24
Abstract:
A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Public/Granted literature
Information query
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