Invention Grant
- Patent Title: Semiconductor package including antenna layer and manufacturing method thereof
- Patent Title (中): 包括天线层的半导体封装及其制造方法
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Application No.: US13789382Application Date: 2013-03-07
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Publication No.: US09129954B2Publication Date: 2015-09-08
- Inventor: Han-Chee Yen , Shih-Yuan Chen , Chien-Pai Lai , Ming-Hsien Cheng
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/56 ; H01L23/552 ; H01L23/66 ; H01L23/00 ; H01L25/16 ; H01L23/538
Abstract:
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.
Public/Granted literature
- US20140252595A1 SEMICONDUCTOR PACKAGE INCLUDING ANTENNA LAYER AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-09-11
Information query
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