公开(公告)号：US09837701B2

公开(公告)日：2017-12-05

申请号：US13783840

申请日：2013-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/00 ,  H01Q9/04 ,  H01L23/66 ,  H01L25/16 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01Q9/0407 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85

Abstract: A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate.

公开(公告)号：US09129954B2

公开(公告)日：2015-09-08

申请号：US13789382

申请日：2013-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L25/16 ,  H01L23/538

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73259 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括衬底，半导体芯片，封装体和天线层。 半导体芯片设置在基板上。 封装体封装半导体芯片并且包括上表面。 天线层形成在封装主体的上表面上并且包括连接在一起的两个天线插槽组。 每个天线槽组包括沿着第一方向延伸的波导槽和沿着第二方向延伸的照射槽群，其中照射槽组连接到波导槽。

公开(公告)号：US20140239465A1

公开(公告)日：2014-08-28

申请号：US13781606

申请日：2013-02-28

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81 ,  H01L24/81

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract translation: 半导体封装包括衬底，接地层，密封剂，屏蔽层和导电元件。 衬底包括芯片。 密封剂封装接地层和芯片，其中密封剂具有上表面。 屏蔽层形成在密封剂的上表面上。 导电元件围绕波导腔并延伸到接地层。 接地层，屏蔽层和导电元件一起形成波导天线。

公开(公告)号：US10811763B2

公开(公告)日：2020-10-20

申请号：US15951091

申请日：2018-04-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen

IPC: H01L23/02 ,  H01Q1/22 ,  H01L23/31 ,  H01Q1/38 ,  H05K1/02 ,  H01L23/14

Abstract: A semiconductor device package includes a circuit layer, an antenna structure, a first encapsulant and a reflector. The circuit layer has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The antenna structure is disposed within the circuit layer. The first encapsulant is disposed on the first surface of the circuit layer, the first encapsulant having a surface. The reflector is disposed on the first encapsulant. The third surface of the circuit layer is substantially coplanar with the surface of the first encapsulant.

公开(公告)号：US09978688B2

公开(公告)日：2018-05-22

申请号：US13781606

申请日：2013-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81 ,  H01L24/81

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

公开(公告)号：US20140247195A1

公开(公告)日：2014-09-04

申请号：US13783840

申请日：2013-03-04

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Han-Chee Yen

IPC: H01Q1/40 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01Q9/0407 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85

Abstract: A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate.

Abstract translation: 半导体封装包括封装基板，半导体器件，天线基板和封装体。 半导体器件设置在封装衬底的上表面上。 天线基板设置在半导体器件上，并且包括芯层，形成在芯层的下表面上的接地层和形成在芯层的上表面上的天线层，并且通过以下方式电连接到接地层 芯层的导电通孔。 封装体封装半导体器件和天线基板。

公开(公告)号：US11848296B2

公开(公告)日：2023-12-19

申请号：US17511472

申请日：2021-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Ying-Nan Liu ,  Min-Yao Cheng

IPC: H01L23/00

CPC classification number: H01L24/35 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/14 ,  H01L2924/19107

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

公开(公告)号：US11664580B2

公开(公告)日：2023-05-30

申请号：US15826543

申请日：2017-11-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01Q9/04 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01Q9/0407 ,  H01L21/561 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/97 ,  H01L2224/85

Abstract: A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.

公开(公告)号：US11239178B2

公开(公告)日：2022-02-01

申请号：US16694847

申请日：2019-11-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan Liu ,  Han-Chee Yen ,  Kuo-Hsien Liao ,  Alex Chi-Hong Chan ,  Christophe Zinck

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.

公开(公告)号：US11158596B2

公开(公告)日：2021-10-26

申请号：US16825725

申请日：2020-03-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Ying-Nan Liu ,  Min-Yao Cheng

IPC: H01L23/00

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.