Invention Grant
- Patent Title: Method for manufacturing an electronic module and an electronic module
- Patent Title (中): 电子模块和电子模块的制造方法
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Application No.: US13591055Application Date: 2012-08-21
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Publication No.: US09129959B2Publication Date: 2015-09-08
- Inventor: Edward Fuergut , Irmgard Escher-Poeppel , Gottfried Beer
- Applicant: Edward Fuergut , Irmgard Escher-Poeppel , Gottfried Beer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H01L23/00 ; H01L21/56
Abstract:
A number of semiconductor chips each include a first main face and a second main face opposite from the first main face. The second main face includes at least one electrical contact element. The semiconductor chips are placed on a carrier. A material layer is applied into intermediate spaces between adjacent semiconductor chips. The carrier is removed and a first electrical contact layer is applied to the first main faces of the semiconductor chips so that the electrical contact layer is electrically connected with each one of the electrical contact elements.
Public/Granted literature
- US20140054780A1 Method for Manufacturing an Electronic Module and an Electronic Module Public/Granted day:2014-02-27
Information query
IPC分类:
