Forming crown active regions for FinFETs

Invention Grant

US09130058B2 Forming crown active regions for FinFETs 有权

Title translation: 形成FinFET的凸起有源区域

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Patent Title: Forming crown active regions for FinFETs
Patent Title (中): 形成FinFET的凸起有源区域
Application No.: US12874039

Application Date: 2010-09-01
Publication No.: US09130058B2

Publication Date: 2015-09-08
Inventor: Chen-Ping Chen , Hui-Min Lin , Ming-Jie Huang , Tung Ying Lee
Applicant: Chen-Ping Chen , Hui-Min Lin , Ming-Jie Huang , Tung Ying Lee
Applicant Address: TW Hsin-Chu
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee Address: TW Hsin-Chu
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L21/8234
IPC: H01L21/8234 ; H01L29/66 ; H01L29/78

Forming crown active regions for FinFETs

Abstract:

A device includes a plurality of intra-device insulation regions having a first height; and a plurality of semiconductor fins horizontally spaced apart from each other by the plurality of intra-device insulation regions. A portion of the plurality of semiconductor fins is disposed above the plurality of intra-device insulation regions. The device further includes a first inter-device insulation region and a second inter-device insulation region with the plurality of semiconductor fins disposed therebetween. The first and the second inter-device insulation regions have a second height greater than the first height.

Abstract(Chinese):

一种器件包括具有第一高度的多个器件内绝缘区域; 以及通过多个器件间绝缘区域彼此水平间隔开的多个半导体鳍片。多个半导体鳍片的一部分设置在多个器件内绝缘区域的上方。该装置还包括第一器件间绝缘区域和设置在其间的多个半导体鳍片的第二器件间绝缘区域。第一和第二器件间绝缘区域具有大于第一高度的第二高度。

Public/Granted literature

US20120049294A1 Forming Crown Active Regions for FinFETs Public/Granted day:2012-03-01

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺