发明授权
- 专利标题： Method of making contact probe
- 专利标题（中）： 制作接触探针的方法
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申请号： US13168136申请日： 2011-06-24
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公开(公告)号： US09134346B2公开(公告)日： 2015-09-15
- 发明人: Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
- 申请人： Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY,KIYOTO MANUFACTURING CO.
- 当前专利权人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY,KIYOTO MANUFACTURING CO.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2006-117440 20060421
- 主分类号： H01R43/00
- IPC分类号： H01R43/00 ; G01R3/00 ; G01R1/067 ; G01R1/073
摘要：
A method of making a contact probe including a step of making a first printed wiring board having a signal electrode and a ground electrode used as a contact part of the contact probe with respect to a measuring object, in which the signal electrode and ground electrode are formed of a metal wiring pattern, and making a second printed wiring board with a coaxial line structure having a shield electrode which encloses a signal line and the surroundings of the signal line through an insulating layer. The signal electrode of the first printed wiring board and the signal line of the second printed wiring board are electrically connected together, and the ground electrode of the first printed wiring board and the shield electrode of the second printed wiring board are electrically connected together.
公开/授权文献
- US20110247209A1 METHOD OF MAKING CONTACT PROBE 公开/授权日：2011-10-13