Invention Grant
- Patent Title: Sintered oxide compact and circuit board using same
- Patent Title (中): 烧结氧化物紧凑型和使用它的电路板
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Application No.: US14390786Application Date: 2013-04-02
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Publication No.: US09136033B2Publication Date: 2015-09-15
- Inventor: Hisashi Kozuka , Tomoko Hishida , Hideto Yamada , Kazushige Ohbayashi
- Applicant: NGK SPARK PLUG CO., LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison, PLLC
- Agent Jeffrey A. Haeberlin
- Priority: JP2012-087078 20120406
- International Application: PCT/JP2013/002283 WO 20130402
- International Announcement: WO2013/150779 WO 20131010
- Main IPC: H01B1/08
- IPC: H01B1/08 ; H05K1/03 ; H05K1/09 ; C04B35/50 ; C04B35/01

Abstract:
Provided is a sintered oxide compact that has high electric conductivity and a small B-value (temperature coefficient), and is suitable for use as an electrically conductive material, and a circuit board that uses the sintered oxide compact. The sintered oxide compact is represented by a composition formula: REaCobNicOx (where RE represents a rare earth element, a+b+c=1, and 1.3≦x≦1.7), the sintered oxide compact includes a perovskite phase with a perovskite-type oxide crystal structure, and the a, b, and c satisfy the following relationships: 0.459≦a≦0.535, 0.200≦b≦0.475, and 0.025≦c≦0.300.
Public/Granted literature
- US20150099142A1 SINTERED OXIDE COMPACT AND CIRCUIT BOARD USING SAME Public/Granted day:2015-04-09
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