发明授权
- 专利标题: Impedence controlled packages with metal sheet or 2-layer RDL
- 专利标题(中): 具有金属片或2层RDL的阻抗控制包装
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申请号: US13472081申请日: 2012-05-15
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公开(公告)号: US09136197B2公开(公告)日: 2015-09-15
- 发明人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
- 申请人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
- 申请人地址: US CA San Jose
- 专利权人: Tessera, Inc.
- 当前专利权人: Tessera, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L23/31 ; H01L23/552 ; H01L23/00 ; H01L25/065 ; H01L23/13 ; H01L23/498
摘要:
A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.