Invention Grant
- Patent Title: Hybrid heat sink and hybrid heat sink assembly for power module
- Patent Title (中): 混合散热器和电源模块的混合散热器组件
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Application No.: US13557158Application Date: 2012-07-24
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Publication No.: US09136201B2Publication Date: 2015-09-15
- Inventor: Aixing Tong , Teng Liu , Jianping Ying
- Applicant: Aixing Tong , Teng Liu , Jianping Ying
- Applicant Address: CN Shanghai
- Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: CKC & Partners Co., Ltd.
- Priority: CN201110424870 20111216
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H05K7/20 ; H01L23/467 ; F28D15/02

Abstract:
Disclosed are a hybrid heat sink and a hybrid heat sink assembly for a power module. The hybrid heat sink comprises a base provided with at least one power module on one side thereof, a first heat dissipation unit being a first heat dissipation fin group which is composed of a plurality of heat dissipation fins intervally arranged and is located on the other side of the base, and a second heat dissipation unit comprising a plurality of heat pipes and a second heat dissipation fin group. Each of the heat pipes comprises an evaporating section provided in the base and close to the power module, a condensing section, and an adiabatic section located between the evaporating section and the condensing section and comprises an extension portion and a folding portion, the second heat dissipation fin group is provided on the condensing sections.
Public/Granted literature
- US20130155616A1 HYBRID HEAT SINK AND HYBRID HEAT SINK ASSEMBLY FOR POWER MODULE Public/Granted day:2013-06-20
Information query
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