An embodiment of the invention provides a manufacturing method of a chip package including: providing a semiconductor wafer having a plurality of device regions separated by a plurality of scribe lines; bonding a package substrate to the semiconductor wafer wherein a spacer layer is disposed therebetween and defines a plurality of cavities respectively exposing the device regions and the spacer layer has a plurality of through holes neighboring the edge of the semiconductor wafer; filling an adhesive material in the through holes wherein the material of the spacer layer is adhesive and different from the adhesive material; and dicing the semiconductor wafer, the package substrate and the spacer layer along the scribe lines to form a plurality of chip packages separated from each other.