发明授权
- 专利标题: Method and apparatus for adhesive bond curing
- 专利标题(中): 粘合剂固化的方法和装置
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申请号: US13779095申请日: 2013-02-27
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公开(公告)号: US09138971B2公开(公告)日: 2015-09-22
- 发明人: Gary E. Jones
- 申请人: The Boeing Company
- 申请人地址: US IL Chicago
- 专利权人: THE BOEING COMPANY
- 当前专利权人: THE BOEING COMPANY
- 当前专利权人地址: US IL Chicago
- 代理机构: Hanley, Flight & Zimmerman, LLC.
- 主分类号: B29C70/74
- IPC分类号: B29C70/74 ; B29C70/76 ; B32B37/00 ; B29C70/46 ; B29C70/88 ; B29C35/02 ; B29C35/16 ; B29K63/00 ; B29K707/04 ; B29L31/08
摘要:
Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.
公开/授权文献
- US20130168022A1 METHOD AND APPARATUS FOR ADHESIVE BOND CURING 公开/授权日:2013-07-04
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