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发明授权
US09142716B2 Optoelectronic semiconductor component, and method for the manufacture of an optoelectronic semiconductor component 有权
光电子半导体元件，以及制造光电半导体元件的方法

Optoelectronic semiconductor component, and method for the manufacture of an optoelectronic semiconductor component
摘要：
In at least one embodiment, the semiconductor component includes a semiconductor layer sequence with an active layer for generating an electromagnetic radiation. The semiconductor component includes a radiation-permeable element and a connecting element. The connecting element is layered in form and connects the radiation-permeable element and the semiconductor layer sequence to another mechanically. The connecting element is designed to be passed through by at least one part of the radiation generated in the active layer. A refractive index of the connecting means deviates from a refractive index of the semiconductor layer sequence by a maximum of 25%. The connecting element includes at least two principal components, which are solids at a temperature of 300 K. At least one of the principal components has a melting temperature of no more than 750 K.
摘要（中）：

在至少一个实施例中，半导体部件包括具有用于产生电磁辐射的有源层的半导体层序列。 半导体部件包括辐射透过元件和连接元件。 连接元件以层叠形式，并将辐射透过元件和半导体层序列机械连接。 连接元件被设计成由有源层中产生的辐射的至少一部分通过。 连接装置的折射率偏离半导体层序列的折射率最多为25％。 连接元件包括至少两个主要成分，其为在300K的温度下的固体。至少一个主成分的熔融温度不超过750K。

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