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US09142736B2 LED (light-emitting diode) encapsulation and manufacturing method thereof 有权
LED（发光二极管）封装及其制造方法

LED (light-emitting diode) encapsulation and manufacturing method thereof
Abstract:
The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and the quantum dot rail (40). The first frame (10) includes a PCB (12) and four sidewalls (14). The four sidewalls (14) surround and circumferentially delimit an accommodation space (18). The plurality of LED elements (20) is mounted on the PCB (12) and in electrical connection therewith. The encapsulant (30) is filled in the accommodation space (18). The four sidewalls (14) each have a top end portion forming a mounting section (16). The quantum dot rail (40) is mounted in the mounting sections (16) so that the quantum dot rail (40) is located above the encapsulant (30). The first frame (10), the plurality of LED elements (20), and the quantum dot rail (40) are collectively and integrally encapsulated so as to be fixedly assembled together.
Abstract(Chinese):

本发明提供一种LED封装及其制造方法。 LED封装包括：第一框架（10），多个LED元件（20），密封剂（30）和量子轨道（40）。 第一框架（10）包括PCB（12）和四个侧壁（14）。 四个侧壁（14）围绕并周向地限定容纳空间（18）。 多个LED元件（20）安装在PCB（12）上并与其电连接。 密封剂（30）填充在容纳空间（18）中。 四个侧壁（14）各自具有形成安装部分（16）的顶端部分。 量子轨道（40）安装在安装部分（16）中，使得量子轨道（40）位于密封剂（30）上方。 第一框架（10），多个LED元件（20）和量子轨道（40）被一体地一体地封装以便被固定地组装在一起。

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