Invention Grant
- Patent Title: XMR sensors with high shape anisotropy
- Patent Title (中): 具有高形状各向异性的XMR传感器
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Application No.: US12946460Application Date: 2010-11-15
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Publication No.: US09146287B2Publication Date: 2015-09-29
- Inventor: Juergen Zimmer , Klemens Pruegl , Olaf Kuehn , Andreas Strasser , Ralf-Rainer Schledz , Norbert Thyssen
- Applicant: Juergen Zimmer , Klemens Pruegl , Olaf Kuehn , Andreas Strasser , Ralf-Rainer Schledz , Norbert Thyssen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: G01R33/02
- IPC: G01R33/02 ; G01R33/09 ; H01L43/08 ; H01L43/12

Abstract:
Embodiments relate to xMR sensors having very high shape anisotropy. Embodiments also relate to novel structuring processes of xMR stacks to achieve very high shape anisotropies without chemically affecting the performance relevant magnetic field sensitive layer system while also providing comparatively uniform structure widths over a wafer, down to about 100 nm in embodiments. Embodiments can also provide xMR stacks having side walls of the performance relevant free layer system that are smooth and/or of a defined lateral geometry which is important for achieving a homogeneous magnetic behavior over the wafer.
Public/Granted literature
- US20120119735A1 XMR SENSORS WITH HIGH SHAPE ANISOTROPY Public/Granted day:2012-05-17
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