Invention Grant
- Patent Title: Module including a discrete device mounted on a DCB substrate
- Patent Title (中): 模块包括安装在DCB基板上的分立器件
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Application No.: US13336248Application Date: 2011-12-23
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Publication No.: US09147637B2Publication Date: 2015-09-29
- Inventor: Ralf Otremba , Roland Rupp , Daniel Domes
- Applicant: Ralf Otremba , Roland Rupp , Daniel Domes
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/24 ; H01L23/373 ; H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L23/31
Abstract:
A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip.
Public/Granted literature
- US20130161801A1 Module Including a Discrete Device Mounted on a DCB Substrate Public/Granted day:2013-06-27
Information query
IPC分类:
