公开(公告)号：US20130161801A1

公开(公告)日：2013-06-27

申请号：US13336248

申请日：2011-12-23

申请人： Ralf Otremba ,  Roland Rupp ,  Daniel Domes

发明人： Ralf Otremba ,  Roland Rupp ,  Daniel Domes

IPC分类号： H01L23/495 ,  H05K7/04 ,  H01L21/56

CPC分类号： H01L23/48 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3735 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37639 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/3766 ,  H01L2224/4005 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/4847 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48771 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8482 ,  H01L2224/8485 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01015 ,  H01L2924/20759

摘要： A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip.

摘要翻译： 模块包括DCB衬底和安装在DCB衬底上的分立器件，其中分立器件包括引线框，安装在引线框上的半导体芯片和覆盖半导体芯片的封装材料。

公开(公告)号：US07656629B2

公开(公告)日：2010-02-02

申请号：US11581039

申请日：2006-10-13

申请人： Jürgen Pullmann ,  Roland Rupp

发明人： Jürgen Pullmann ,  Roland Rupp

IPC分类号： H02H7/00

CPC分类号： H01H47/002 ,  H01H47/004 ,  H03K17/965

摘要： A safety switch for safety circuit arrangement has a control part for processing an input signal and at least one switching element with at least one active and one inactive switching state. The control part controls the switching element in order to generate an output signal dependent on the input signal at an output. In addition, the safety switch has a diagnostic function for identifying a functional fault. The control part is configured to transfer the switching element into the inactive state when a functional fault is identified. According to one aspect of the invention, the control part is also configured to generate a data message at the output, which data message is dependent on the functional fault.

摘要翻译： 用于安全电路装置的安全开关具有用于处理输入信号的控制部分和具有至少一个有效和无效切换状态的至少一个开关元件。 控制部分控制开关元件，以便根据输出端的输入信号产生输出信号。 另外，安全开关具有识别功能故障的诊断功能。 控制部分被配置为当识别功能故障时将开关元件传送到非活动状态。 根据本发明的一个方面，控制部分还被配置为在输出端生成数据消息，该数据消息取决于功能故障。

公开(公告)号：US20090032848A1

公开(公告)日：2009-02-05

申请号：US11830542

申请日：2007-07-30

申请人： Michael Treu ,  Roland Rupp ,  Michael Rueb ,  Rudolf Elpelt

发明人： Michael Treu ,  Roland Rupp ,  Michael Rueb ,  Rudolf Elpelt

IPC分类号： H01L29/808 ,  H01L21/266 ,  H01L21/337

CPC分类号： H01L29/66068 ,  H01L21/0465 ,  H01L29/1029 ,  H01L29/66909 ,  H01L29/8083

摘要： A method for manufacturing a semiconductor device. The method includes providing a semiconductor body of a conductivity type, wherein the semiconductor body comprises a first surface. At least one buried region of a second conductivity type is formed in the semiconductor body and at least a surface region of the second conductivity type is formed at the first surface of the semiconductor body, wherein the buried region and the surface region are formed such that they are spaced apart from each other. The buried region is formed by deep implantation of a first dopant of the second conductivity type.

摘要翻译： 一种半导体器件的制造方法。 该方法包括提供导电类型的半导体本体，其中半导体主体包括第一表面。 在半导体本体中形成至少一个第二导电类型的掩埋区域，并且至少在第二导电类型的表面区域形成在半导体本体的第一表面处，其中形成掩埋区域和表面区域使得 它们彼此间隔开。 埋入区域通过深度注入第二导电类型的第一掺杂剂形成。

公开(公告)号：US20080203517A1

公开(公告)日：2008-08-28

申请号：US12037269

申请日：2008-02-26

申请人： MICHAEL RUEB ,  Roland Rupp ,  Michael Treu

发明人： MICHAEL RUEB ,  Roland Rupp ,  Michael Treu

IPC分类号： H01L27/06 ,  H01L21/822

CPC分类号： H01L29/872 ,  H01L29/08 ,  H01L29/6609 ,  H01L29/66143 ,  H01L29/861

摘要： A semiconductor component is proposed which has a semiconductor body having a first semiconductor zone of the first conduction type, at least one first rectifying junction with respect to the first semiconductor zone, at least one second rectifying junction with respect to the first semiconductor zone, wherein the three rectifying junctions each have a barrier height of different magnitude.

摘要翻译： 提出了一种半导体元件，其具有半导体本体，其具有第一导电类型的第一半导体区，相对于第一半导体区的至少一个第一整流结，相对于第一半导体区的至少一个第二整流结，其中 三个整流接头各自具有不同大小的屏障高度。

公开(公告)号：US20070204662A1

公开(公告)日：2007-09-06

申请号：US11604507

申请日：2006-11-27

申请人： Jurgen Pullmann ,  Roland Rupp ,  Andreas Veit ,  Peter Eichinger

发明人： Jurgen Pullmann ,  Roland Rupp ,  Andreas Veit ,  Peter Eichinger

IPC分类号： E05B47/00 ,  H01H9/00

CPC分类号： F16P3/10 ,  E05B15/101 ,  E05B15/102 ,  E05B17/10 ,  E05B41/00 ,  E05B47/0046 ,  E05B63/04 ,  E05B2047/0069 ,  E05B2047/0086 ,  Y10S292/31 ,  Y10T70/5761 ,  Y10T70/7062 ,  Y10T70/7102 ,  Y10T70/7107 ,  Y10T70/713 ,  Y10T70/8027 ,  Y10T292/0999 ,  Y10T292/1003 ,  Y10T292/1021 ,  Y10T292/1031 ,  Y10T292/18 ,  Y10T292/558 ,  Y10T292/57

摘要： There is disclosed a safety switch for generating an enable signal as a function of the position of a moveable guard door. The safety switch comprises a door part and a frame part. The door part has an activator, which can be displaced between a first and a second position. The frame part has a cutout, in which the activator can engage in the second position. A locking element is arranged on the door part in order to lock the activator in the second position. A sensor is designed to detect at least one of the positions of the activator in order to generate the enable signal as a function thereof.

摘要翻译： 公开了一种用于根据可移动防护门的位置产生使能信号的安全开关。 安全开关包括门部和框架部。 门部具有一个可在第一和第二位置之间移动的活化器。 框架部分具有切口，其中活化器可以啮合在第二位置。 锁定元件设置在门部上，以将活化器锁定在第二位置。 传感器被设计成检测激活器的至少一个位置，以便产生作为其功能的使能信号。

公开(公告)号：US20070108513A1

公开(公告)日：2007-05-17

申请号：US11540922

申请日：2006-09-29

申请人： Michael Rub ,  Herbert Schafer ,  Armin Willmeroth ,  Anton Mauder ,  Stefan Sedlmaier ,  Roland Rupp ,  Manfred Pippan ,  Hans Weber ,  Frank Pfirsch ,  Franz Hirler ,  Hans-Joachim Schulze

发明人： Michael Rub ,  Herbert Schafer ,  Armin Willmeroth ,  Anton Mauder ,  Stefan Sedlmaier ,  Roland Rupp ,  Manfred Pippan ,  Hans Weber ,  Frank Pfirsch ,  Franz Hirler ,  Hans-Joachim Schulze

IPC分类号： H01L31/00

CPC分类号： H01L29/7813 ,  H01L21/76224 ,  H01L29/0653 ,  H01L29/165 ,  H01L29/66734 ,  H01L29/7804 ,  H01L29/7849

摘要： The fabrication of a semiconductor component having a semiconductor body in which is arranged a very thin dielectric layer having sections which run in the vertical direction and which extend very deeply into the semiconductor body is disclosed. In one method a trench is formed in a drift zone region proceeding from the front side of a semiconductor body, a sacrificial layer is produced on at least a portion of the sidewalls of the trench and at least a portion of the trench is filled with a semiconductor material which is chosen such that the quotient of the net dopant charge of the semiconductor material in the trench and the total area of the sacrificial layer on the sidewalls of the trench between the semiconductor material and the drift zone region is less than the breakdown charge of the semiconductor material, and the sacrificial layer is replaced with a dielectric.

摘要翻译： 公开了具有半导体主体的半导体部件的制造，其中布置有具有在垂直方向上延伸并且非常深地延伸到半导体本体中的截面的非常薄的电介质层。 在一种方法中，在从半导体主体的前侧开始的漂移区域中形成沟槽，在沟槽的至少一部分侧壁上产生牺牲层，并且沟槽的至少一部分填充有 半导体材料被选择为使得沟槽中的半导体材料的净掺杂剂电荷的商和半导体材料和漂移区域之间的沟槽的侧壁上的牺牲层的总面积小于击穿电荷 的半导体材料，并且牺牲层被电介质代替。

公开(公告)号：US06995467B2

公开(公告)日：2006-02-07

申请号：US10291062

申请日：2002-11-08

申请人： Michael Herfurth ,  Roland Rupp ,  Ilia Zverev

发明人： Michael Herfurth ,  Roland Rupp ,  Ilia Zverev

IPC分类号： H01L23/34

CPC分类号： H01L23/13 ,  H01L25/18 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00

摘要： A semiconductor component contains two semiconductor bodies, which are spatially separated from one another and electrically interconnected. A compensation MOS field effect transistor is provided as the first semiconductor body, and a silicon carbide Schottky diode is provided as the second semiconductor body. Consequently, the semiconductor component can advantageously be produced significantly more compactly and more cost-effectively, since both the compensation MOS field-effect transistor and the silicon carbide Schottky diode contribute to a significant reduction of power loss.

公开(公告)号：US06871240B2

公开(公告)日：2005-03-22

申请号：US10080111

申请日：2002-02-21

申请人： Roland Rupp ,  Klaus Wohnhaas ,  Hans Schwenkel

发明人： Roland Rupp ,  Klaus Wohnhaas ,  Hans Schwenkel

IPC分类号： H04L12/40 ,  G06F3/00

CPC分类号： H04L12/403 ,  H04L12/40013 ,  H04L2012/40208

摘要： The present invention describes a method of allocating a defined user address to a safe bus user when connecting it to a field bus of a safe control system. The method comprises the step of sending out a first registration message from the safe bus user to an administration unit connected to the field bus. The first registration message contains a predetermined universal address. The method further comprises the step of sending out an address allocation message from the administration unit to the safe bus user, wherein the address allocation message contains the defined user address. Finally, the method comprises the step of storing the defined user address in a memory of the safe bus user.

摘要翻译： 本发明描述了一种在将安全总线用户连接到安全控制系统的现场总线时将定义的用户地址分配给安全总线用户的方法。 该方法包括从安全总线用户向连接到现场总线的管理单元发送第一注册消息的步骤。 第一注册消息包含预定的通用地址。 该方法还包括从管理单元向安全总线用户发送地址分配消息的步骤，其中地址分配消息包含定义的用户地址。 最后，该方法包括将定义的用户地址存储在安全总线用户的存储器中的步骤。

公开(公告)号：US06805881B1

公开(公告)日：2004-10-19

申请号：US09787229

申请日：2001-04-23

申请人： Venkata-Rangarao Kanikanti ,  Roland Rupp ,  Erich Brendel ,  Claus Weisemann ,  Ernst Chantraine

发明人： Venkata-Rangarao Kanikanti ,  Roland Rupp ,  Erich Brendel ,  Claus Weisemann ,  Ernst Chantraine

IPC分类号： A61K914

CPC分类号： A61K31/4422 ,  A61K9/1652

摘要： The present invention relates to orally administrable multiple-unit sustained-release dose forms having controlled agitation-independent release of active compound and processes for their production using a selected erodable hydrophilic polymer (HPC) and a limitation of the maximum size of the active compound-containing polymer particles to ≦3 mm.

摘要翻译： 本发明涉及具有受控搅动独立的活性化合物释放的可口服给药的多单位缓释剂量形式及其使用选择的可侵蚀亲水性聚合物（HPC）的生产方法，以及活性化合物 - 含有聚合物颗粒至<= 3MM。

公开(公告)号：US06740167B1

公开(公告)日：2004-05-25

申请号：US09630154

申请日：2000-07-31

申请人： Roland Rupp ,  Arno Wiedenhofer

发明人： Roland Rupp ,  Arno Wiedenhofer

IPC分类号： H01L2100

CPC分类号： H01L21/68757 ,  C30B25/02 ,  C30B25/12 ,  C30B29/36 ,  H01L21/6835 ,  H01L21/68771

摘要： A device for mounting a substrate includes a susceptor as a support for the substrate to be coated. The susceptor includes an insert whose surface is at least partly formed by a metal carbide layer of a predetermined thickness. The device for mounting the substrate eliminates a contamination of the substrate during processing, such as during production of an epitaxial layer on a wafer. A method for producing the insert includes the steps of producing a metallic preform, embedding the metallic preform in a carbon-containing powder, heating the metallic preform and the carbon-containing powder to an elevated temperature, hard processing the heat-treated preform and disposing the hard-processed preform on the susceptor as an insert.

摘要翻译： 用于安装基板的装置包括作为待涂覆的基板的支撑体的基座。 基座包括一个插入件，其表面至少部分地由预定厚度的金属碳化物层形成。 用于安装衬底的装置消除了在处理期间衬底的污染，例如在晶片上制造外延层期间的污染。 一种用于制造刀片的方法包括以下步骤：制备金属预成型件，将金属预成型件嵌入含碳粉末中，将金属预成型件和含碳粉末加热至高温，对热处理预制件进行硬化处理 在基座上的硬处理预制件作为插入物。