Invention Grant
- Patent Title: Electronic circuit substrate, display device, and wiring substrate
- Patent Title (中): 电子电路基板,显示装置和布线基板
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Application No.: US14002346Application Date: 2012-03-01
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Publication No.: US09148957B2Publication Date: 2015-09-29
- Inventor: Takashi Matsui , Motoji Shiota , Hiroki Nakahama
- Applicant: Takashi Matsui , Motoji Shiota , Hiroki Nakahama
- Applicant Address: JP Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: Chen Yoshimura LLP
- Priority: JP2011-047452 20110304
- International Application: PCT/JP2012/055266 WO 20120301
- International Announcement: WO2012/121113 WO 20120913
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H01L23/00 ; H05K1/11 ; G02F1/1345 ; H01L23/498

Abstract:
A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).
Public/Granted literature
- US20130335940A1 ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE Public/Granted day:2013-12-19
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