公开(公告)号：US09207477B2

公开(公告)日：2015-12-08

申请号：US14113886

申请日：2012-04-23

申请人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

发明人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

IPC分类号： G02F1/1333 ,  G02F1/1345 ,  F21V8/00

CPC分类号： G02F1/133308 ,  G02B6/0001 ,  G02F1/1333 ,  G02F1/13336 ,  G02F1/13452

摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.

摘要翻译： 本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。

公开(公告)号：US20120236230A1

公开(公告)日：2012-09-20

申请号：US13510721

申请日：2010-09-15

申请人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

发明人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

IPC分类号： G02F1/1335 ,  H01J9/00 ,  H05K13/04 ,  H05K1/18

CPC分类号： G02F1/1345 ,  G02F2001/13456 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02185 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1146 ,  H01L2224/13006 ,  H01L2224/13019 ,  H01L2224/16 ,  H01L2224/16013 ,  H01L2224/16112 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81424 ,  H01L2224/81481 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T156/10 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

摘要翻译： 公开了一种器件基板，其中在其表面上形成有端子（24）的绝缘层（60）形成在除了显示部分之外的玻璃基板（20）的整个表面上，因此，边界（外围 绝缘层（60）不接近设置有NCF（81）的区域，即靠近LSI芯片（40）的区域。 这防止绝缘层（60）被NCF（81）从其边界剥离，从而防止端子（24）断裂。 此外，端子（24）和突起电极（40a）通过绝缘层（60）的弹性而彼此永久地压接，并且可以确保其间的稳定的电连接。

公开(公告)号：US20130335940A1

公开(公告)日：2013-12-19

申请号：US14002346

申请日：2012-03-01

申请人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

发明人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  G02F1/13454 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10165 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).

摘要翻译： 布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。 多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部 部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

公开(公告)号：US20120080789A1

公开(公告)日：2012-04-05

申请号：US13377780

申请日：2010-02-02

申请人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

发明人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

IPC分类号： H01L23/498

CPC分类号： H01L24/14 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13013 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/13099 ,  H01L2224/81 ,  H01L2224/83

摘要： Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface.

摘要翻译： 提供了一种在端子之间具有窄间距的半导体芯片，该芯片能够抑制芯片与其上安装芯片的基板之间的连接不良的发生。 在包括输入凸块组的LSI芯片中，所述输入凸块组由沿其底面的一个长边排列的多个输入凸块和输出凸块组组成，所述输出凸块组由多个输出凸块组成， 沿着底面的另一长边交错排列，在设置有输入凸块组的区域和设置有输出凸块组的区域之间的区域中设置有虚设凸块组，该虚设凸块组包括多个 具有沿着与底面的长边垂直的方向延伸的长边的矩形伪凸块。

公开(公告)号：US20140092338A1

公开(公告)日：2014-04-03

申请号：US14113886

申请日：2012-04-23

申请人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

发明人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

IPC分类号： G02F1/1333 ,  F21V8/00

CPC分类号： G02F1/133308 ,  G02B6/0001 ,  G02F1/1333 ,  G02F1/13336 ,  G02F1/13452

摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.

摘要翻译： 本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。

公开(公告)号：US09148957B2

公开(公告)日：2015-09-29

申请号：US14002346

申请日：2012-03-01

申请人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

发明人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

IPC分类号： H05K7/00 ,  H05K1/18 ,  H01L23/00 ,  H05K1/11 ,  G02F1/1345 ,  H01L23/498

CPC分类号： H05K1/18 ,  G02F1/13454 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10165 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).

摘要翻译： 布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。 多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部 部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

公开(公告)号：US08421979B2

公开(公告)日：2013-04-16

申请号：US13003790

申请日：2009-05-21

申请人： Yukio Shimizu ,  Takashi Matsui ,  Motoji Shiota ,  Keigo Aoki ,  Hiroki Nakahama

发明人： Yukio Shimizu ,  Takashi Matsui ,  Motoji Shiota ,  Keigo Aoki ,  Hiroki Nakahama

IPC分类号： G02F1/1345

CPC分类号： G02F1/13452

摘要： A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).

摘要翻译： 包括用于驱动显示区域（41）的电路的驱动IC芯片（21）安装在面板基板（11）上。 在面板基板（11）和驱动IC芯片（21）之间插入各向异性导电膜（31），并将驱动IC芯片（21）的凸块电极（22）与电极焊盘（27）电连接 面板基板（11）。 各向异性导电膜（31）被布置成延伸超过驱动IC芯片（21）的一个特定侧表面（21a）以外的所有侧表面（21b至21d）。

公开(公告)号：US20110122337A1

公开(公告)日：2011-05-26

申请号：US13003790

申请日：2009-05-21

申请人： Yukio Shimizu ,  Takashi Matsui ,  Motoji Shiota ,  Keigo Aoki ,  Hiroki Nakahama

发明人： Yukio Shimizu ,  Takashi Matsui ,  Motoji Shiota ,  Keigo Aoki ,  Hiroki Nakahama

IPC分类号： G02F1/1335 ,  G02F1/1345

CPC分类号： G02F1/13452

摘要： A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).

摘要翻译： 包括用于驱动显示区域（41）的电路的驱动IC芯片（21）安装在面板基板（11）上。 在面板基板（11）和驱动IC芯片（21）之间插入各向异性导电膜（31），并将驱动IC芯片（21）的凸块电极（22）与电极焊盘（27）电连接 面板基板（11）。 各向异性导电膜（31）被布置成延伸超过驱动IC芯片（21）的一个特定侧表面（21a）以外的所有侧表面（21b至21d）。

公开(公告)号：US20120133876A1

公开(公告)日：2012-05-31

申请号：US13262216

申请日：2010-01-15

申请人： Hiroki Nakahama ,  Keigo Aoki ,  Gen Nagaoka ,  Kiyoshi Inada ,  Motoji Shiota

发明人： Hiroki Nakahama ,  Keigo Aoki ,  Gen Nagaoka ,  Kiyoshi Inada ,  Motoji Shiota

IPC分类号： G02F1/1343

CPC分类号： G02F1/133528

摘要： A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate (10) and a second glass substrate (20) which face each other with a liquid crystal therebetween. The first glass substrate (10) and the second glass substrate (20) are formed in substantially the same size in plan view and bonded together in a state in which these substrates are shifted from each other by a predetermined distance in the direction of the longer side or in the direction of the shorter side. Regions to become a frame (frame regions) are provided on both the first glass substrate (10) and the second glass substrate (20), and pads (60) are provided on both of these frame regions.

摘要翻译： 在配置有液晶面板的玻璃基板上充分确保了用于安装诸如IC芯片的部件的区域，而不会减少从大面板取出的面板件的数量。 液晶面板由第一玻璃基板（10）和第二玻璃基板（20）构成，第一玻璃基板（10）和第二玻璃基板（20）之间具有液晶。 第一玻璃基板（10）和第二玻璃基板（20）在平面图中形成为大致相同的尺寸，并且在这些基板沿较长的方向彼此偏移预定距离的状态下接合在一起 侧或在短边方向。 在第一玻璃基板（10）和第二玻璃基板（20）两者上设置成为框架（框架区域）的区域，并且在这两个框架区域上设置焊盘（60）。

公开(公告)号：US20110019125A1

公开(公告)日：2011-01-27

申请号：US12933159

申请日：2008-11-10

申请人： Hiroki Nakahama ,  Kiyoshi Inada

发明人： Hiroki Nakahama ,  Kiyoshi Inada

IPC分类号： G02F1/1333 ,  H05K1/00 ,  H05K1/09

CPC分类号： H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a mounted board (11) comprising a feed wire (13) for supplying a current to a circuit element (21). In this mounted board (11), when a region of a mounting surface (12A) of the mounted board (11) overlapping the circuit element (21) is defined as a mounting area (MA), a reinforcing wire (17) overlapping a corner (PP) of the mounting area (MA) is formed on the mounting surface (12A).

摘要翻译： 公开了一种安装板（11），其包括用于向电路元件（21）提供电流的馈线（13）。 在该安装板（11）中，当安装板（11）的与电路元件（21）重叠的安装面（12A）的区域被定义为安装区域（MA）时，将与 安装面（MA）的角部（PP）形成在安装面（12A）上。