Invention Grant
- Patent Title: Lead free solder bumps
- Patent Title (中): 无铅焊料凸块
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Application No.: US14558089Application Date: 2014-12-02
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Publication No.: US09156111B2Publication Date: 2015-10-13
- Inventor: Sung Jae Hong , Keun Soo Kim , Chang Woo Lee , Jung Hwan Bang , Yong Ho Ko , Hyuck Mo Lee , Jae Won Chang , Ja Hyun Koo , Jeong Tak Moon , Young Woo Lee , Won Sik Hong , Hui Joong Kim , Jae Hong Lee
- Applicant: MK ELECTRON CO., LTD. , HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY , KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY , KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Applicant Address: KR KR KR KR KR
- Assignee: MK ELECTRON CO., LTD.,HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY,KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Current Assignee: MK ELECTRON CO., LTD.,HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY,KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Current Assignee Address: KR KR KR KR KR
- Agency: Volpe and Koenig, P.C.
- Priority: KR10-2013-0149999 20131204
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; B23K31/00 ; B23K35/26 ; B23K35/02 ; H01L23/00 ; B23K1/00

Abstract:
Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
Public/Granted literature
- US20150151386A1 LEAD-FREE SOLDER, SOLDER PASTE AND SEMICONDUCTOR DEVICE Public/Granted day:2015-06-04
Information query
IPC分类: