Invention Grant
- Patent Title: Semiconductor device including a solder and method of fabricating the same
- Patent Title (中): 包括焊料的半导体器件及其制造方法
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Application No.: US14170809Application Date: 2014-02-03
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Publication No.: US09159688B2Publication Date: 2015-10-13
- Inventor: Jong Yun Myung , Yonghwan Kwon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0013037 20130205
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31
Abstract:
A semiconductor device includes a bonding pad on a semiconductor substrate, a bump on the bonding pad, a solder on the bump, and an anti-wetting layer between the bump and the solder extending along a sidewall of the bump, the anti-wetting layer having a first thickness T1 along the sidewall of the bump closer to the solder and a second thickness T2 along the sidewall of the bump closer to the bonding pad, wherein T2
Public/Granted literature
- US20140217580A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-08-07
Information query
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