公开(公告)号：US09159688B2

公开(公告)日：2015-10-13

申请号：US14170809

申请日：2014-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Yun Myung ,  Yonghwan Kwon

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11906 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13655 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2924/15311 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a bonding pad on a semiconductor substrate, a bump on the bonding pad, a solder on the bump, and an anti-wetting layer between the bump and the solder extending along a sidewall of the bump, the anti-wetting layer having a first thickness T1 along the sidewall of the bump closer to the solder and a second thickness T2 along the sidewall of the bump closer to the bonding pad, wherein T2

Abstract translation: 一种半导体器件包括：半导体衬底上的焊盘，焊盘上的凸块，凸块上的焊料，以及沿着凸块的侧壁延伸的凸块和焊料之间的防潮湿层，防湿层 沿凸块的靠近焊料的侧壁具有第一厚度T1，沿凸点的侧壁更靠近焊盘的第二厚度T2，其中T2