Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. A package can include a chip package situated below a lower surface of a first substrate, the package including a die situated on a top surface of a second substrate, a molding disposed over the upper surface of the second substrate, the molding extending over the second die and including an opening extending from an upper surface of the molding towards an upper surface of the second substrate, wherein the opening is configured to admit at least a portion of the solder ball, and a solder column electrically and mechanically coupled to the second substrate, situated in the opening, conforming to the cylinder, and including at least two layers of solder with flux therebetween.