发明授权
- 专利标题： Pattern-forming method, and radiation-sensitive resin composition
- 专利标题（中）： 图案形成方法和辐射敏感树脂组合物
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申请号： US13855749申请日： 2013-04-03
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公开(公告)号： US09164387B2公开(公告)日： 2015-10-20
- 发明人: Hirokazu Sakakibara , Masafumi Hori , Koji Ito , Reiko Kimura , Taiichi Furukawa
- 申请人： JSR CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： JSR CORPORATION
- 当前专利权人： JSR CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-225259 20101004
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/20 ; C08F20/28 ; G03F7/039 ; G03F7/11 ; G03F7/32 ; C08F220/28
摘要：
A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.
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