Invention Grant
- Patent Title: Vapor cell atomic clock physics package
- Patent Title (中): 蒸汽电池原子钟物理包
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Application No.: US14083067Application Date: 2013-11-18
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Publication No.: US09164491B2Publication Date: 2015-10-20
- Inventor: Jeff A. Ridley , Robert Compton , Mary K. Salit , Jeffrey James Kriz
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: G04F5/14
- IPC: G04F5/14

Abstract:
In an example, a chip-scale atomic clock physics package is provided. The physics package includes a body defining a cavity having a base surface and one or more side walls. The cavity includes a first step surface and a second step surface defined in the one or more side walls. A first scaffold mounted to the base surface in the cavity. One or more spacers defining an aperture therethrough are mounted to the second step surface in the cavity. A second scaffold is mounted to a first surface of the one or more spacers spans across the aperture of the one or more spacers. A third scaffold is mounted to a second surface of the one or more spacers in the cavity and spans across the aperture of the one or more spacers. Other components of the physics package are mounted to the first, second, and third scaffold.
Public/Granted literature
- US20140062608A1 VAPOR CELL ATOMIC CLOCK PHYSICS PACKAGE Public/Granted day:2014-03-06
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